MEMS
-
Analog Top & Bottom Port Microphones
-
Digital Top & Bottom Port Microphones
-
High SNR
-
Small Package
-
Max RF protection
-
Omnidirectional
-
Wide-band Frequency Response
因为BSE MEMS Microphone使用silicon wafer process,所以在多种环境中的performance得到了进一步提高。而且,相对于ECM(Electret Condenser Microphones),其规格越趋小型化。

本MEMS microphones被广泛应用于cell phones、smart phones、smart TV、PDAs、digital still cameras、IC recorders、laptop PCs、notebook、robot cleaners、refrigerators、tablet PCs等Customer电器音响产品,MEMS Microphone以最典型的ECM(Electret Conderser Microphones)工作原理作为基础。

本MEMS Microphone以T&R(Tape and Real)方式的包装形式予以提供,基本上可适用自动化的SMT Process。
View Output Size
[mm]
Sound
Port
Sensitivity
(dB relV/1Pa)
SNR
[dB(A)]
AOP
[dBSPL]
Data
Sheet
Analog 3.76x2.95x1.10 Top -42±3 59 124
Analog 3.76x2.95x1.10 Bottom -38±3 63 121 Link
Analog 3.50x2.65x0.98 Bottom -38±1 66 122 Link
Analog 3.10x2.50x1.10 Top -42±3 59 128 Link
Analog 2.75x1.85x0.90 Bottom -38±3 62.5 123 Link
Digital 4.72x3.76x1.10 Top -26±3 61.5 122 Link
Digital 4.00x3.00x1.00 Top -26±3 61 122 Link
Digital 3.50x2.65x0.98 Bottom -26±1 64.3 121 Link
-26±1 62 121
Digital 3.50x2.65x0.98 Bottom -36±1 63.5 132 Link
-27.5±1 62.2 123